The University of California, Davis will be part of a new, $285 million nationwide institute dedicated to advancing research and manufacturing of American semiconductors.

The new institute, known as SMART USA (Semiconductor Manufacturing and Advanced Research with Twins USA) will develop, validate and use digital twins to improve domestic semiconductor design, manufacturing, advanced packaging, assembly and test processes. 

Digital twins are virtual models that replicate physical objects, like chips or complex machinery. 

SMART USA will join an existing network of 17 institutes designed to increase U.S. manufacturing competitiveness and promote a robust R&D infrastructure. 

S. J. Ben Yoo, Distinguished Professor of electrical and computer engineering, will lead the UC Davis part of SMART USA together with Anh-Vu Pham, Omeed Momeni, Avesta Sasan, Houman Homayoun and Saif Islam, also professors in the Department of Electrical and Computer Engineering.

“This is a significant development in the semiconductor manufacturing and research ecosystem for this nation,” Yoo said. “UC Davis’ strength in collaborative research across multiple disciplines, coupled with a strong alliance of community colleges and K-12 institutions in the greater Sacramento region for driving workforce development, in partnership with the Semiconductor Research Corporation and strong support by our campus, enabled this exciting launch of the institute.” 

The project will leverage UC Davis strengths: in photonics; radio frequency, millimeter and TeraHertz wave technology; microelectronics and artificial intelligence; and its unique collaborative infrastructure with industry, academia and national laboratories covering research and workforce development. 

Creating digital twins

Led by the Semiconductor Research Corporation, SMART USA works toward creating and using digital twins to advance, accelerate and optimize manufacturing in the semiconductor industry. In particular, the UC Davis part of the new institute will highlight digital twins in photonic, electronic, analog, digital, radio frequency/millimeter/TeraHertz wave semiconductor manufacturing for AI and numerous applications.

In semiconductor chip manufacturing, a digital twin can provide a replica of a production line that simulates and optimizes processes, allowing researchers to test new designs and manufacturing techniques without having to build them first. The process results in significant savings in time and money and speeds innovation. 

The SMART USA Institute is the winner of the U.S. Department of Commerce’s CHIPS Manufacturing USA Institute competition, which sought to create a new, nationwide network of researchers to support domestic manufacturing of semiconductor chips. The institute will be headquartered in North Carolina. 

“This partnership exemplifies the power of public and private sectors working together to ensure America’s technological leadership and national security,” said Simon Atkinson, vice chancellor for research at UC Davis. “We are proud to be part of such a remarkable network and look forward to seeing the impact of this important investment.”

The winning proposal was supported by cost-share funding provided by UC Davis and the Department of Electrical and Computer Engineering, totaling approximately $1 million over the five-year project lifespan. The SMART USA consortium comprises more than 150 organizations at this initial stage, including large corporations, small and medium-sized businesses, national labs, government entities, trade organizations and academic institutions. 

A ceremony announcing the award to SMART USA was held Tuesday, Nov. 19, at the Semiconductor Research Corporation’s headquarters in North Carolina. The CHIPS for America program was created as part of the CHIPS and Science Act of 2022, which provides over $50 billion to strengthen U.S. semiconductor manufacturing, research and supply chains. It is part of an effort to strengthen the domestic semiconductor industry and reduce dependency on foreign suppliers.